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Chips Act: can Europe catch up in the global semiconductor race?

Pascal Vivet_VF
Pascal Vivet
Researcher at CEA-Leti on the Program for Co-optimisation of Design Technologies, Silicon Components Division
Key takeaways
  • Adopted by the EU in 2023, the Chips Act aims to strengthen the continent’s industrial capabilities and reduce certain strategic dependencies.
  • It aims to mobilise up to €43 billion in investment and increase the European Union’s share of global semiconductor production to 20% by 2030.
  • Around fifteen years ago, European manufacturers gradually stopped competing in the technology race, leaving the field open to American and Asian players.
  • Europe therefore does not currently have the human resources needed to rapidly deploy several state-of-the-art mega-factories.
  • On the other hand, it has large, solid industrial groups, but it still lacks a dense network of start-ups capable of producing the sector’s future leaders.

Since short­ages caused by the Cov­id-19 health crisis, the high con­cen­tra­tion of pro­duc­tion in Taiwan and the Sino-Amer­ic­an tech­no­logy war over arti­fi­cial intel­li­gence, semi­con­duct­ors have occu­pied a spe­cial place in indus­tri­al policy. Found in smart­phones, data centres, vehicles, med­ic­al equip­ment and defence sys­tems, they account for a grow­ing share of tech­no­lo­gic­al invest­ment and sov­er­eignty strategies1.

In this land­scape dom­in­ated by a hand­ful of play­ers cap­able of pro­du­cing the most advanced chips, Europe finds itself in a very spe­cif­ic pos­i­tion. The con­tin­ent has lead­ing com­pan­ies in cer­tain seg­ments of the value chain, start­ing with ASML in EUV litho­graphy, but remains absent from the man­u­fac­ture of the most advanced nodes, a sec­tor cur­rently dom­in­ated by TSMC and Sam­sung2. This situ­ation has led the European Uni­on to adopt the Chips Act, which aims to strengthen the continent’s indus­tri­al cap­ab­il­it­ies and reduce cer­tain stra­tegic depend­en­cies3. How­ever, the chal­lenge is not lim­ited to build­ing new factor­ies or mas­ter­ing the most mini­atur­ised man­u­fac­tur­ing processes.

Some of the work cur­rently being car­ried out in industry and research focuses on oth­er tech­no­lo­gic­al path­ways, not­ably around chip­lets, het­ero­gen­eous integ­ra­tion and advanced com­pon­ent assembly tech­niques4. These approaches make it pos­sible to com­bine, with­in a single sys­tem, tech­no­lo­gic­al build­ing blocks developed using dif­fer­ent pro­cesses, rather than simply con­tinu­ing the race towards miniaturisation.

The European Chips Act at a glance

Adop­ted in 2023, the Chips Act is the European Union’s flag­ship ini­ti­at­ive in the semi­con­duct­or sec­tor. It aims to mobil­ise up to €43 bil­lion in pub­lic and private invest­ment and to increase the European Union’s share of glob­al pro­duc­tion to 20% by 2030. The scheme sup­ports research, indus­tri­al capa­city and the secur­ity of sup­ply chains. Sev­er­al major pro­jects have already been announced, not­ably in Ger­many, France and Italy.

As Sci­entif­ic Dir­ect­or of the “Integ­ra­tion and Pack­aging” pro­gramme at CEA-Leti, Pas­cal Viv­et has been work­ing on advanced semi­con­duct­or integ­ra­tion tech­no­lo­gies for numer­ous years5. His research focuses in par­tic­u­lar on three-dimen­sion­al archi­tec­tures, chip­lets and assembly pro­cesses that enable dif­fer­ent elec­tron­ic func­tions to be com­bined with­in a single sys­tem. Not­able among these pro­jects is the IntAct pro­ject, which is ded­ic­ated to new multi-core archi­tec­tures based on the three-dimen­sion­al stack­ing of chip­lets6.

Chal­lenges and object­ives of the EU Chips Act. Source: European Com­mis­sion. European Par­lia­ment. Statista

Why are people already talk­ing about a Chips Act 2.0?

Whilst the first pro­jects sup­por­ted by the Chips Act are still being rolled out, sev­er­al European offi­cials and industry play­ers are already dis­cuss­ing a second phase of the European semi­con­duct­or strategy.

The first phase focused largely on pro­duc­tion capa­city and indus­tri­al invest­ment. Cur­rent dis­cus­sions are centred more on fund­ing for design com­pan­ies, skills, research, advanced integ­ra­tion tech­no­lo­gies and sec­tors where Europe already holds a strong position. 

No offi­cial ini­ti­at­ive has yet been adop­ted under the name “Chips Act 2.0”. The term is, how­ever, increas­ingly being used to refer to this pos­sible evol­u­tion of European semi­con­duct­or policy.

Today, Europe does not produce the most technologically advanced chips, whilst some global players are already manufacturing them at 3 nm. In your view, what are the technological obstacles behind this gap?

His­tor­ic­ally, Europe pos­sessed expert­ise in the most advanced tech­no­lo­gies, driv­en in par­tic­u­lar by STMi­cro­elec­tron­ics, Infin­eon and NXP. But around fif­teen years ago, European man­u­fac­tur­ers gradu­ally stopped pur­su­ing this tech­no­lo­gic­al race, leav­ing the field open to Amer­ic­an play­ers (such as Intel) and Asi­an play­ers such as TSMC and Sam­sung, who were the only ones cap­able of mobil­ising the massive invest­ments now required.

The cur­rent gap is more a mat­ter of invest­ment than a tech­no­lo­gic­al short­fall. Europe retains world-class expert­ise, par­tic­u­larly in litho­graphy through ASML. At CEA-Leti, work is con­tinu­ing on advanced FD-SOI pilot lines around the 10 nm mark, with the aim of trans­fer­ring these innov­a­tions to industry. Achiev­ing more advanced tech­no­logy nodes there­fore remains pos­sible. Mov­ing from 28 nm or 18 nm, cur­rently used indus­tri­ally in Europe, to 10 nm or 7 nm would already rep­res­ent a con­sid­er­able tech­no­lo­gic­al leap. The real ques­tion is what resources Europe is pre­pared to com­mit to this ambition.

The value chain relies on a few highly concentrated links, such as ASML for EUV lithography, TSMC for advanced manufacturing, and Cadence, Synopsys and SIEMENS for design. In your view, what is the most critical bottleneck for Europe if it is to genuinely achieve greater autonomy?

The main vul­ner­ab­il­ity lies in the eco­sys­tem of design com­pan­ies, the fab­less com­pan­ies [edit­or­’s note: com­pan­ies without their own factor­ies], which devel­op new cir­cuit archi­tec­tures and new sys­tems. It is often with­in these organ­isa­tions that the most dis­rupt­ive innov­a­tions emerge. Europe has large, robust indus­tri­al groups, but it still lacks a dense net­work of start-ups cap­able of nur­tur­ing the sector’s future lead­ers. The United States has long benefited from a par­tic­u­larly dynam­ic eco­sys­tem, sup­por­ted by ven­ture cap­it­al cap­able of rap­idly fuel­ling the growth of innov­at­ive com­pan­ies. Two examples worth not­ing are start-ups design­ing AI accel­er­at­ors using advanced tech­no­lo­gies, such as AXELERA (in the Neth­er­lands) and VSORA (in France).

The Chips Act aims to address these chal­lenges by cre­at­ing shared design plat­forms, provid­ing com­mon tools and open tech­no­logy lib­rar­ies7. How­ever, the main dif­fi­culty remains the abil­ity to fin­ance the scal­ing up of these com­pan­ies. European start-ups often have the neces­sary skills and ideas, but struggle to scale up quickly enough to com­pete with their Amer­ic­an or Asi­an rivals. The prob­lem is there­fore not so much tech­no­lo­gic­al as fin­an­cial. Europe is still strug­gling to rap­idly trans­form its innov­a­tions into lead­ing indus­tri­al players.

Fab­less com­pan­ies, foundries, equip­ment man­u­fac­tur­ers: who does what in the semi­con­duct­or industry?

Chip man­u­fac­tur­ing relies on sev­er­al dis­tinct sec­tors. So-called fab­less com­pan­ies design elec­tron­ic archi­tec­tures but do not own man­u­fac­tur­ing plants. NVIDIA, Qual­comm and AMD oper­ate accord­ing to this mod­el. Foundries, such as TSMC and Sam­sung, phys­ic­ally pro­duce the chips for their cus­tom­ers.
Oth­er play­ers sup­ply elec­tron­ic design tools, such as Cadence, Syn­opsys and SIEMENS, a European CAD com­pany, or the indus­tri­al equip­ment required for man­u­fac­tur­ing, such as ASML for litho­graphy. This increas­ing spe­cial­isa­tion explains why no single com­pany cur­rently con­trols the entire glob­al value chain.

Europe has a proven advantage in FD-SOI thanks to STMicroelectronics and GlobalFoundries. Can this position serve as a genuine pillar of technological sovereignty, or are we confined to a segment that is too limited to compete with advanced CMOS?

FD-SOI is a real asset for Europe, even if it does not cov­er all its needs. For high-per­form­ance com­put­ing applic­a­tions, data centres or the most advanced arti­fi­cial intel­li­gence infra­struc­ture, cut­ting-edge CMOS remains indis­pens­able. On the oth­er hand, for fields such as quantum com­put­ing, micro­con­trol­lers, ima­ging, sensors, low-power applic­a­tions or cyber­se­cur­ity, FD-SOI offers sig­ni­fic­ant advant­ages and can be a key dif­fer­en­ti­at­ing factor. Provided the neces­sary invest­ment con­tin­ues, this tech­no­logy can there­fore rep­res­ent a stra­tegic pil­lar across a range of major indus­tri­al applications.

Building an advanced semiconductor factory takes years and requires highly specialised skills. Does Europe currently have the human and industrial resources needed to scale up capacity, or is there a risk of underutilisation?

The issue of skills is one of the main chal­lenges. At present, Europe does not yet have the human resources required to rap­idly roll out sev­er­al state-of-the-art mega-factor­ies. This is pre­cisely one of the issues addressed under the Chips Act. In France in par­tic­u­lar, sig­ni­fic­ant efforts are under­way in uni­ver­sit­ies, engin­eer­ing schools, research organ­isa­tions and labor­at­or­ies to increase train­ing capa­city and the num­ber of gradu­ates in fields related to micro­elec­tron­ics. But devel­op­ing the skills required for an industry of this scale takes time. Even with adequate indus­tri­al invest­ment, build­ing up human resources is a long-term process.

The European Chips Act aims for 20% of global production by 2030. From a strictly technological perspective, setting aside political considerations, do you think this target is achievable?

It is dif­fi­cult to assess, as indus­tri­al tra­ject­or­ies depend so heav­ily on tech­no­lo­gic­al, human and polit­ic­al factors. Bey­ond the tech­no­lo­gic­al chal­lenges them­selves, we must con­sider the time required to ramp up pro­duc­tion, recruit­ment dif­fi­culties and the com­plex­ity of European decision-mak­ing pro­cesses. The polit­ic­al will is there but trans­lat­ing it into oper­a­tion­al action is often a slower pro­cess. The tar­get is ambi­tious and sends an import­ant sig­nal to European industry. As for wheth­er it will be achieved by 2030, it is still too early to say.

Within the global value chain, certain components remain virtually impossible to replace, such as ASML’s EUV equipment or certain high-purity materials produced by only a handful of suppliers. Of these dependencies, which do you believe is currently the most critical for Europe if it is to secure its production capacity in the long term?

No single tech­no­lo­gic­al bot­tle­neck cur­rently appears to be pre­vent­ing Europe from mov­ing for­ward. Access to ASML’s EUV equip­ment, for example, remains assured as it is a European tech­no­logy. The main obstacles seem to lie more in the areas of invest­ment, skills, indus­tri­al organ­isa­tion, design cap­ab­il­it­ies and the devel­op­ment of the entre­pren­eur­i­al ecosystem.

In the cur­rent geo­pol­it­ic­al con­text, char­ac­ter­ised by mount­ing inter­na­tion­al ten­sions and a resur­gence of con­cerns over sov­er­eignty, Europe nev­er­the­less has a sig­ni­fic­ant oppor­tun­ity. Grow­ing demand in the defence, space and crit­ic­al infra­struc­ture sec­tors is cre­at­ing a favour­able envir­on­ment for the devel­op­ment of new indus­tri­al cap­ab­il­it­ies. Even if Europe lags some­what behind in the most advanced pro­cesses, the invest­ments made today could yield sig­ni­fic­ant res­ults with­in the next 5 to 10 years.

Why is advanced man­u­fac­tur­ing con­cen­trated in Taiwan?

The most advanced chips require con­sid­er­able indus­tri­al invest­ment. A single fact­ory can cost tens of bil­lions of euros. Over time, only a few play­ers have retained the fin­an­cial and tech­no­lo­gic­al cap­ab­il­it­ies needed to keep up with this race, not­ably TSMC and Sam­sung. This con­cen­tra­tion explains why semi­con­duct­or pro­duc­tion has become a mat­ter of nation­al sov­er­eignty for many countries.

The race for semiconductors is often seen as a race to master the most advanced technology nodes. Does this view truly reflect the industrial challenges facing the sector today?

Not entirely. The focus on the most advanced tech­no­logy nodes some­times provides an incom­plete pic­ture of cur­rent indus­tri­al chal­lenges. One of the major devel­op­ments in the sec­tor con­cerns het­ero­gen­eous integ­ra­tion, that is, the abil­ity to com­bine sev­er­al spe­cial­ised tech­no­lo­gies with­in a single sys­tem. The aim is no longer simply to man­u­fac­ture a single, ever-more-mini­atur­ised chip, but to assemble dif­fer­ent chip­lets spe­cific­ally ded­ic­ated to com­put­ing, memory, sensors, power man­age­ment, cyber­se­cur­ity or communications.

3D integ­ra­tion and advanced pack­aging tech­no­lo­gies make it pos­sible to bring these dif­fer­ent tech­no­lo­gic­al build­ing blocks togeth­er. In this field, Europe already has sig­ni­fic­ant strengths. CEA-Leti in France, as well as sev­er­al organ­isa­tions in Ger­many and Bel­gi­um, have been devel­op­ing recog­nised expert­ise in these fields for sev­er­al years. This approach can meet the needs of stra­tegic European sec­tors such as the auto­mot­ive, aerospace and defence indus­tries, quantum com­put­ing, AI, com­mu­nic­a­tions and sensors, whilst lim­it­ing the costs and risks asso­ci­ated with the con­stant race for the most advanced processes.

Chip­lets: a dif­fer­ent approach to semi­con­duct­or design

Rather than integ­rat­ing all func­tions onto a single chip, the chip­let approach involves assem­bling sev­er­al spe­cial­ised com­pon­ents, such as com­put­ing, memory, sensors or secur­ity, using their respect­ive tech­no­lo­gies. Com­bined with 3D integ­ra­tion and advanced pack­aging tech­no­lo­gies, chip­lets offer great­er flex­ib­il­ity and enable dif­fer­ent man­u­fac­tur­ing pro­cesses to be com­bined with­in a single sys­tem. This approach is now play­ing an increas­ingly import­ant role in the semi­con­duct­or industry.

Does Europe have any particular strengths it could draw on to strengthen its position in the global semiconductor ecosystem?

Europe has strong pos­i­tions in sev­er­al areas that com­ple­ment the semi­con­duct­or sec­tor itself. Embed­ded soft­ware, embed­ded sys­tems, cyber­se­cur­ity and tech­no­lo­gies for pro­tect­ing digit­al infra­struc­ture are sec­tors in which European play­ers pos­sess recog­nised expert­ise. These cap­ab­il­it­ies are essen­tial for secur­ing data centres, cloud infra­struc­ture, pub­lic ser­vices and crit­ic­al indus­tri­al sys­tems. They rep­res­ent import­ant levers for tech­no­lo­gic­al sov­er­eignty and enable Europe to main­tain strong pos­i­tions in high value-added segments.

In practical terms, if Europe were to decide to significantly increase its investment in semiconductors and related technologies, which areas should be prioritised?

This ques­tion is cur­rently the sub­ject of much debate with­in the European eco­sys­tem. Quantum com­put­ing is already attract­ing sig­ni­fic­ant invest­ment. Indus­tri­al applic­a­tions are still some way off, but fail­ing to invest today would mean fall­ing behind in a way that could prove irre­vers­ible tomorrow.

In the semiconductor sector, another key question concerns advanced CMOS. Should Europe develop its own capabilities, or should it attract more advanced production to European soil to secure strategic supplies?

Both approaches remain on the table. At the same time, Europe would bene­fit from step­ping up its invest­ment in areas where it already has com­pet­it­ive advant­ages: het­ero­gen­eous integ­ra­tion, FD-SOI, the Inter­net of Things, indus­tri­al robot­ics, Industry 4.0, cyber­se­cur­ity and tech­no­lo­gies for the health­care sec­tor. Micro­elec­tron­ics now lies at the heart of all these eco­sys­tems. Strength­en­ing these sec­tors there­fore amounts to strength­en­ing European tech­no­lo­gic­al sov­er­eignty more broadly.

Interview by Aicha Fall
1European Com­mis­sion, European Chips Act, 2024: https://​digit​al​-strategy​.ec​.europa​.eu/​e​n​/​p​o​l​i​c​i​e​s​/​e​u​r​o​p​e​a​n​-​c​h​i​p​s-act
2ASML, EUV Litho­graphy Sys­tems: https://​www​.asml​.com/​p​r​o​d​u​c​t​s​/​e​u​v​-​l​i​t​h​o​g​r​a​p​h​y​-​s​y​stems
3European Com­mis­sion, European Chips Act, 2024: https://​digit​al​-strategy​.ec​.europa​.eu/​e​n​/​p​o​l​i​c​i​e​s​/​e​u​r​o​p​e​a​n​-​c​h​i​p​s-act
4IEEE Elec­tron­ics Pack­aging Soci­ety, Het­ero­gen­eous Integ­ra­tion Roadmap (HIR): https://​eps​.ieee​.org/​t​e​c​h​n​o​l​o​g​y​/​h​e​t​e​r​o​g​e​n​e​o​u​s​-​i​n​t​e​g​r​a​t​i​o​n​-​r​o​a​dmap/
5CEA-Leti, Bio­graph­ie Pas­cal Viv­et: https://​leti​-innov​a​tion​-days​.com/​s​p​e​a​k​e​r​/​p​a​s​c​a​l​-​v​ivet/
6Pas­cal Viv­et, Eric Guth­muller, Yvain Thon­nart, Gaël Pil­lon­net, Cesar Fuguet, et al.. IntAct : A 96-Core Pro­cessor With Six Chip­lets 3D-Stacked on an Act­ive Inter­poser With Dis­trib­uted Inter­con­nects and Integ­rated Power Man­age­ment. IEEE Journ­al of Sol­id-State Cir­cuits, 2021, 56 (1), pp.79–97. https://​hal​.sci​ence/​h​a​l​-​0​3​0​7​2​9​5​9​v​1​/​d​o​c​ument
7EuroCDP, Europe’s Chip Design Plat­form: https://​eurocdp​.eu

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